Package Design Engineer - reading, england, United Kingdom - Cisco Systems, Inc.

    Cisco Systems, Inc.
    Cisco Systems, Inc. reading, england, United Kingdom

    1 week ago

    £80,000 - £100,000 per year * Technology / Internet
    Description

    Cisco Silicon One in Reading, UK is at the forefront of developing Cisco's groundbreaking silicon solutions for next-generation networking. Our team designs and optimizes advanced package solutions for industry-leading ASICs. Collaborate with experts in layout, signal integrity, and power distribution to shape innovative methodologies and drive high-performance networking technologies.

    Your Impact

    This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. As a lead engineer, you will drive the entire package design process from planning and optimization to execution, ensuring delivery of high-speed, robust, and scalable solutions for global networks. You will mentor engineers, define strategies, and collaborate across multi-functional teams to accelerate the creation of industry-leading silicon packages.

    Responsibilities

    • Lead package design tasks, planning and driving schedules from concept through implementation
    • Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance and manufacturability
    • Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency
    • Work closely with layout editors to deliver high-quality package designs aligned with interface requirements
    • Enhance design methodologies and partner with vendors to improve product quality and efficiency
    • Drive innovation in package solutions for Cisco's next-generation ASICs

    Minimum Qualifications

    • Bachelor's degree in Electrical Engineering or a related field
    • Experience in ASIC package design, including optimizing pinouts, stack-ups, and high-speed routing
    • Familiarity with relevant industry-standard EDA tools for layout and design for chip package development & simulations
    • Practical experience in chip packaging processes, including vendor collaboration and management to ensure successful package development
    • Strong understanding of high-speed signal design and power distribution networks (PDN)
    • Strong analytical and problem-solving skills in debugging and optimizing package designs

    Preferred Qualifications

    • Master's degree in Electrical Engineering
    • Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
    • Proven track record to drive design improvements and lead stakeholder coordination throughout the design process
    • Familiarity with advanced testing and measurement equipment, including oscilloscopes and TDR/VNA analyzers
    * This salary range is an estimation made by beBee
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