- Participate in the Semiconductor packaging, assembly process development, prototyping, and bill of materials (BOM) strategies for single die, multi-die or system in package (SIP) packaging solutions for power electronics/ RF/ Photonics
- Provide package design inputs, material selection and assembly process development for a number of different semiconductor packages
- Follow the semiconductor/ micro-electronic package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable packaging processes such as Die attach technologies, Flip-Chip, hybrid bonding, Wire bond, SIP (System in Package)
- R&D of assembly interconnects and interfaces
- Semiconductor package prototyping, testing, reliability & failure analysis
- Develop semiconductor assembly process of interpreting reports derived from design of experiments (DOEs) and ensure all potential obstacles are identified and provide mitigation plans for identified issues
- Work with internal design and products teams and drive design for manufacturing (DFM) methodology for new technologies
- Actively research to resolve semiconductor assembly interconnect challenges through developing new integration schemes and characterisation of novel packaging architectures involving highly technical and scientific methods
- Study microelectronics assembly process, bonding materials and apply the knowledge to develop advanced interconnects for compound semiconductor device and module packaging
- Gather customer requirements and follow procedures to build assembly process relevant to the project work.
- Conduct experiments to determine material properties and relate these to project work
- Use results from simulations and experiments to aid package design
- Operate key assembly equipment and undertake process and SOP development
- Generate technical reports on results and conclusions drawn from experiments conducted and incorporate findings in formal specifications
- Estimate set-up times, flow-times, costs of production and acceptance equipment
- As needed, performs support functions for project planning to achieve quality, delivery schedules, and cost objectives
- Work closely with suppliers providing technical specifications and procuring components and test equipment to specification and budget
- Participate in technical risk assessments
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My client is seeking a Senior Packaging Process Engineer with strong expertise in 3D semiconductor integration and high-density interconnects. This is an onsite position, based in Wales. · The role focuses on developing and validating 2.5D/3D packaging solutions, including fine-p ...
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Process Engineer - Newport - Catapult
Description
Reporting to the Engineering Manager, the Packaging Process Engineer will work in a challenging R&D environment to explore and develop disruptive packaging and integration technologies to make next-generation systems more energy and packaging efficient.
The Process Engineer will work with a team of multidisciplinary engineers to develop novel semiconductor chip assembly and integration processes for advanced packaging of compound semiconductor-based devices, modules and systems.
They will apply their knowledge to solve the assembly and bonding challenges in the advanced packaging of compound semiconductor products using a wide range of die and wire bonding materials. Key responsibilities include:
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Principal Process Engineer
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Process Engineer
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