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    Principal Semiconductor Packaging Engineer - London, United Kingdom - IC Resources

    IC Resources background
    Full time
    Description

    Our exciting new technology start-up is currently searching for an experienced, dynamic and self starting IC Packaging Engineer to be responsiblefor the design of complex packaging solutions for multi-die devices.

    The role will involve developing and maintaining the architecture of the entire product, as well as providing expertise within the IC packaging world.

    Remote and hybrid working can be offered with this role.

    Required skills for the Principal Semiconductor Packaging Engineer will include:

    Strong IC semiconductor packaging experience and knowledgeAdvanced packaging knowledgeCadence EDA tool experienceSI/EMC analysis experienceStrong communication skills and a start-up mentalityDegree qualifiedPlease contact Rachel Anderson for further information.


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