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    Senior Packaging Engineer - Oxford, United Kingdom - IC Resources

    IC Resources background
    Full time
    Description
    Our cutting edge client is currently searching for a Packaging Engineer to join the photonics operations team.

    The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture.

    Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.


    Required skills for the Packaging Engineer will include:

    Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding etcKnowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development.

    Photonics packaging experience desirableStrong communication skillsMaster's degree in a relevant technical fieldPlease contact Rachel Anderson for further details.

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